Ultraviolet-transmitting window

ABSTRACT

An ultraviolet-transmitting glass window assembly comprising a metalic mounting ring containing an ultraviolet-transmitting glass is made by placing a preformed ultraviolet-transmitting glass member in the center of the metallic ring which has a higher coefficient of thermal expansion than the glass, heating the resulting assembly to melt the glass whereby it completely fills the ring, and cooling the assembly whereby a compression seal is achieved due to the greater shrinkage of the metalic ring. This window assembly is sealed over the memory chip of a programable read only memory package to provide for ultraviolet erasure of the program information stored in the memory device.

Scherer ULT RAVIOLET-TRANSMITTING WINDOW Inventor: Jeremy D. Scherer, Dartmouth,

Mass.

Assignee:

Filed: May 15, 1974 Appl. No.1 470,123

OTHER PU BLlCATlONS Zechman, Alterable Read-Only Memory lB M Technical Disclosure Bulletin, Vol. 14, No. ll. 4/72; pp.- 3296-3297.

lsommcs Q s Ah ul'traviolet transmitting glass window assembly '1 '1 1"; 3,924,246 1451* Dec, 2 1975 Prim ar'y Examiner.Stuart N. Hccker 1 ABS T RACT- comprising a metalic mounting ring containing zin I I ultraviolet trans'mitting glass is' made by placing a preformed ultraviolet-transmitting glass member in the center-of the metallic ring which has a higher coefficient of.thermal expansion than the glass. heating the resulting assembly to'melt the glass whereby it completely fills the ring, and cooling the assembly whereby a compression seal is achieved due to the greater shrinkage of the metalic ring. This window assembly is sealed over the memory chip of a progrannable read only niemory package. to provide for ultraviolet cratsureof the program information stored in-the memory device;

ll Claims,' 4 Drawing Figures I 1 7 7 flww az-e zizmwxiz //j r I O ULTRAVIOLET-TRANSMITTING WINDOW I BACKGROUND OF THE INVENTION (PROM) has also proved useful in many applications.

It has recently been discovered that the program information stored in a PROM can be erased by exposing the memory chip to ultraviolet light. This erasure does not harm the chip and the erased PROM can be reprogrammed in the same manner as it was programmed originally. In order to facilitate the erasing procedure, industry has turned to a PROM package with a ultraviolet-transmitting cover. The ultraviolettransmitting covers commonly used in the art are made from quartz or artifical quartz (fused silica). The quartz PROM covers of the prior art have a number of drawbacks. Because quartz has such a high melting point,

the forming of PROM covers from this relatively cheap raw material is very expensive. The quartz covers also require time consuming and expensive finishing steps such as mechanical machining and lapping them into therethrough,

and an."ul traviolebtransm'itting glass membersealed within said aperture,-said m'etalic memberhaving a higher coefficient of thermal expansion than said'gla ss member, whereby the glass-to-metal seal is effected by compression. The invention also provides a method ofmaking thiswindow assembly which comprises forming a metalic mounting member with an aperture there-through, placing a preformed ultraviolettransmitting glass member within said aperture, said metalic member having a higher rate of thermalexpansion than said glass member, heating the resulting assembly whereby the glass member melts and fills the aperture of the metalic member, and cooling the assembly whereby said'metalic mounting member shrinks upon said glass member to form acompressionseal. The invention also providcs a PROM with the above described window assembly sealed over the memory chip of the. package. and a method of making this PROM which comprises 'forming the window assembly as previously described and sealing it to the package.

Theinvention will be better understood from a consideration of the detailed description of the preferred embodiment given in connection with the following drawings.

BRIEF DESCRIPTION OF THE DRAWINGS,

' FIG. 1 represents a plan view of'one embodiment of I the ultraviolet-transmitting window'assemblyof t e present invention.

FIG. 2 represents a sectional view of the same assembly'taken along line 2-2 of FIG. I.

shape. In addition, there does not appear to be any way to make a reliable hermetic seal with quartz at a reasonable cost.

Quartz covers are currently sealed onto the PROM package in two ways. The first method is to affix the quartz cover to the package with epoxy. This method has proven unsatisfactory for most applications since FIG. 3 represents a plan view of an alternate embodiment of the .window assembly of the. present invention.

moisture can migrate through the epoxy'seal and dam- I age the sensitive memory chip. Additionally, since epoxy will not generally provide good adherence between smooth surfaces, it is often necessary to abraid or etch the edge of the quartz. This abrasion creates additional channels for the transmission of moisture.

through the epoxy seal. The second method now employed to seal quartz covers to PROM packages isto metalize a ring around the edge of the quartz and then solder the metalized surface to the package. One disadvantage to this method is that metalizing the quartz is a very expensive procedure. Metalization is also a so- FIG 4 represents an elevational view of the PROM of the invention with the windowassem bly sealed in place-over the memory chip.

'- DES CRIPTION'OF THE PREFERRED EMBODIMENT:

Reference is now made to the window assembly of the present invention as shown in FIG. I..This window assembly 1 consists of a metalic mounting member 2 and ultraviolet transmitting glass member 3. The glass member 3 can be any glass which will pass ultraviolet light, i.e.', light in the frequcncyof-2537 angstroms. In order to effect PROM erasure in a practical length of time and with normal dose levels, the glass must pass phisticated and tricky process which may produce defects in the metalized seal.

SUMMARY OF THE INVENTION The present invention provides an improved ultraviolet-transmitting window assembly suitable for use with a PROM which has none of the drawbacks of the prior art covers.

It is an object of the invention to provide a window assembly which is transparent to ultraviolet light and easy and inexpensive to manufacture.

It is a further object ofthe invention to provide a win- I ent' a reasonable amount of the ultraviolet light. For most applications the'glass should preferrably pass about 60pe rcent or more of the ultravioletlight. Representative of such materials are the iron-free boro silicate glasses. These borosilicate glasses generally havea low coefficient of thermal expansion, normally in the irange of 37 to 39 X 10 in/in/C. The metalic mounting member 2 can be any metal which has a higher coefficiofthermal expansion than theultraviolettransmitting glass member employed. The preferred metals include Kovar, a trade name for an alloy consist- 1 ing of 29 percent nickel, 17 percent cobalt and the remainderiron; and coldrolled steel. The coefficient of thermal expansion of Kovar is approximately 55 X It) dow assembly which may be hermetically sealed to a PROM package in a simple and reliablemanner.

Generally described, the invention provides an ultraviolet-transmitting window assembly which comprises a metalic mounting member with an aperture in/ih/"C and that of cold rolled steel is X 10 in /in/."C. Kovar is the most'preferred-s'ince it matches the 1 expansion of most package materials, e.g., alumina.

' Cold rolled steel has the advantage of reduced cost.

Both the metalic mounting member and the glass member should have a relatively flat cross section. The winv dow assembly may be formed in any suitable shape.

Contemplated are, for example, a round glass disc in a, square, rectangular, or circular shaped mounting memher with a round aperture thcrcthrough. Both the shape ofthc glass disc and the mounting member may be varied to fit the particular application. The preferred configuration, as shown in FIG. 1, is with a square shaped mounting member, since most micro-circuit packages are in this form. The overall dimensions of thewindow assembly will vary according to the PROM design.

An important aspect of the window assemblyof the present invention is the glass-to-metal seal 4. The glassto-metal seals of the prior art fall into two groups 4 matched seals and compression seals. The matched seal is made by selecting a glass and metal with about the same coefficient of thermal expansion. A compression seal is formed when the metal has a higher coefficient of thermal expansion than the glass and therefore shrinks in on the glass upon cooling. The seal of the present invention is of the latter type due to the differences in thermal expansion coefficients of the materials specified.

Unlike the seal of the present invention, prior art borosilicate glass-to-metal seals have been of the matched type. For example, it is known to make daylighttransmitting window assemblies from borosilicate glass for use in photocell applications. The glasses used in this type of window have a coefficient of thermal expansion in the range of 53 to 57 X in/in/C, and there are a number of common metalic materials which 1 can match this range. These highly thermal expansive borosilicate glasses do not pass ultraviolet light. The

borosilicate glasses which do pass ultraviolet light, as

indicated above, have a coefficient of thermal expansion in the range of 37 to 39 X 10 in/in/C. There are no readily available metals or alloys which can match this expansion rate. Tungsten is the only metal that comes close and it is too expensive to be practical.

The prior art also discloses compression seals for use in some photocell applications. These compression seals, however, are made from potash, soda, lime or lead containing glasses, and none of these pass ultraviolet light.

Contrary to the teachings in the art, I have discovered that excellent compression seals can be made using low thermally expansive ultraviolet-transmitting borosilicate glasses and metals possessing a wide range of higher thermal expansion values. Mayer US. Pat. No. 3,035,372 teaches that there must be substantial differences in expansion in order to achieve a good hermetic seal. In spite of this I have found that Kovar (expansion 55 X 10* in/in/C forms good hermetic compression seals with ultraviolet-transmitting borosilicate glasses (expansion 37-39 IO in/in/C). By the same token, steel (expansion I40 in/in/C) is not normally I used'with borosilicate glasses for making compression seals. Dalton US. Pat. No. 2,770,923 teaches that such a large mismatch would produce too large a force and harm the seal. The seals of this invention, however,

have extreme compression and they do not crack.

I lower melting point. In the preferred embodiment, the

ultraviolet-transmitting glass batch materials are melted in a conventional crucible furnace and drawn into a rod. The rod is then centerless ground to'a diameter'jusl slightly smaller: thanthe aperture in the met- Thccutting' operation leaves the surfaces of the disc alic mounting member. Next the rod is sliced into discs which are justslightly thicker than thc'mctulic member:

unclear.

This disc, also referred to as a window preform, is

placed within the aperture of the metalic mounting member and the resulting assembly is passed through a furnace. The furnace temperature is maintained substantially above the melting point of the glass so that the disc melts and fills the aperture ofthe mounting memeber. 'Some wetting between thehglass and the metal will occur at the edge. As the'assembly cools, the

metalic mounting member will shrink .upon the glass and form acompression seal due to the difference in thermal expansion rates.

- abovetemperatur'es for about aminute. This of course will depend on the mass ofthe part, and the heating capacity ofthe furnace. The resulting window assembly is relatively flat, free from flaws andquite clear.

Reference is now made to FIG. 4, which represents the PROM of the presentinvention covered with the above described window assembly. The PROM 5 has a.

cavity in its upper surface which contains the memorychip 6. Around this'cavity is a lid mounting 'ring 7.

Sealed to this ring is the ultraviolet-transmitting wi n dow assembly I described in detail above.

The windowassembly can be scaled togthc PROM? mounting ring in a number of ways. Where the-chip is.

' moisture sensitive anda reliable hermetic seal-is de-, I sired the window assembly can be soldered to the, ring.

In this embodiment the assembly is' first plated with a' suitable metal in, for example, a plating barrel. This is quite inexpensive since many thousands can be plated;

simultaneously. After the parts are plated they .can be soldered in place using tin/lead solder, tinlsilver solder, gold/tin eutectic, gold/tin/germanium eute'etic,or any other type of solder normally employed insemiconductor manufacture. The soldering can be accomplished ina conveyorized furnace, in batches or even individu allyQWith the proper type of package the window as sembly of this invention could even be welded inplace. The window assembly of the present invention may also be employed in devices WhGtC hermeticity is not required. In this typeof application, environmental protection can be obtained by. affixing the window a ssembly to the packagewith epoxy. The completed PROM assembly may be easily erased and electrically reprogrammed. For example, an integrated dose (i.e., UV intensity X exposure) of 6W- sec/em of light at a wavelength of 2537 -A will com-' pletely erase the memory in about 10 to 20 rninutes when the chip is about one inch from the UV source. Any suitable source of UV light may be used, such as ultraviolet lamps manufactured by the Ultra Violet; Products, Inc. (San Gabriel, Cal).

FIG. 3Jrepresents an alternate embodimentof the window assembly I of the invention having a circular shaped m etalic mounting member 12. The elements of this assembly 12, 13, and 14 correspond respectively to elements 2, 3 and 4 of FIG. 1. v

While certain specific embodiments of the invention have been described with particularity it is recognized that various modifications thereof will occur to those 1. An erasable programable read only memory device comprising a semi-conductor package having a cavity extending inwardly from one surface thereof, an

erasable programmable memory chip disposed within said cavity, a metallic mounting member disposed about the periphery of said cavity on said one surface, said metallic mounting member having an aperture therethrough, and an ultraviolet-transmitting glass member sealed within said aperture, said metallic I mounting member having a higher coefficient of thermal expansion than said glass member, and said glass member being sealed within the aperture of said metallic mounting member by the compressive forces be ber.

2. The erasable programable read only memory device of claim 1 wherein said aperture is circular.

3. The erasable programable read only memory detween said glass member and metallic mounting mem- 1 vice of claim 1 wherein said metalic mounting member is square.

4. The erasable programable read only memory device of claim 1 wherein said metalic mounting member is rectangular.

.6.-'lhc erasable progra'mablc read only' memory dcvice-of claim 1 wherein said aperture is-centrally disposed ,in said metalic mounting member.-

7.:The erasable pro gramable read only memory deviceof claim 1' wherein said glass member is a borosilicate glass with a thermal expansion rate from about 37 to about 39 X l0" in/in/fC. I

8. Th e erasable. programable read only memory device of claim 1 wherein said chipis hermetically sealed with'in'said cavity.

'9.'The erasablepro'gram read onlymemory' device of claim -8 wherein said metallic mounting member is soldered onto said one surface of said semi-conductor package. r t

-l0'. The erasable programable read only memory device-of claim 8 wherein said metallic mounting member is.welc led onto said one surface of said semi-conductor package. i

l 1. In an erasable pr'ogramable read only memory dcvice'c omprising a semiconductor package containing an exposed erasable memory chip and an ultraviolettransmitting cover sealed in position over said chip, the

improvement wherein .said cover comprises a window assembly comprising ametallic mounting member with an aperture therethrough, l and an ultraviolettransmitting glass me'mber sealed within said aperture,

said metallic' member having a' higher coefficient of thermal expansion than said glass member, and said glass member being sealed within the aperture of said 5. The erasable programable read only memory device of claim 1 wherein said metalic mounting member is circular.

metallic mounting member by the compressive forces between said glass member and metallic mounting member. i 

1. An erasable programable read only memory device comprising a semi-conductor package having a cavity extending inwardly from one surface thereof, an erasable programmable memory chip disposed within said cavity, a metallic mounting member disposed about the periphery of said cavity on said one surface, said metallic mounting member having an aperture therethrough, and an ultraviolet-transmitting glass member sealed within said aperture, said metallic mounting member having a higher coefficient of thermal expansion than said glass member, and said glass member being sealed within the aperture of said metallic mounting member by the compressive forces between said glass member and metallic mounting member.
 2. The erasable progrAmable read only memory device of claim 1 wherein said aperture is circular.
 3. The erasable programable read only memory device of claim 1 wherein said metalic mounting member is square.
 4. The erasable programable read only memory device of claim 1 wherein said metalic mounting member is rectangular.
 5. The erasable programable read only memory device of claim 1 wherein said metalic mounting member is circular.
 6. The erasable programable read only memory device of claim 1 wherein said aperture is centrally disposed in said metalic mounting member.
 7. The erasable programable read only memory device of claim 1 wherein said glass member is a borosilicate glass with a thermal expansion rate from about 37 to about 39 X 10 7 in/in/*C.
 8. The erasable programable read only memory device of claim 1 wherein said chip is hermetically sealed within said cavity.
 9. The erasable program read only memory device of claim 8 wherein said metallic mounting member is soldered onto said one surface of said semi-conductor package.
 10. The erasable programable read only memory device of claim 8 wherein said metallic mounting member is welded onto said one surface of said semi-conductor package.
 11. In an erasable programable read only memory device comprising a semi-conductor package containing an exposed erasable memory chip and an ultraviolet-transmitting cover sealed in position over said chip, the improvement wherein said cover comprises a window assembly comprising a metallic mounting member with an aperture therethrough, and an ultraviolet-transmitting glass member sealed within said aperture, said metallic member having a higher coefficient of thermal expansion than said glass member, and said glass member being sealed within the aperture of said metallic mounting member by the compressive forces between said glass member and metallic mounting member. 